Reference Thermal Solution
24
Intel
®
E7230 Chipset Memory Controller Hub (MCH)
Thermal/Mechanical Design Guide
6.5
Plastic Wave Soldering Heatsink Thermal Solution
Assembly
The reference thermal solution for the chipset MCH is a passive extruded heatsink with thermal
interface. It is attached using a clip with each end hooked through an anchor soldered to the board.
Figure 6-5
shows the reference thermal solution assembly and associated components.
Full mechanical drawings of the thermal solution assembly and the heatsink clip are provided in
Appendix B
.
Appendix A
contains vendor information for each thermal solution component.
Figure 6-3. Plastic Wave Soldering Heatsink Board Component Keepout
TN
B
Heatsink Fin
26.79 mm
48.0 mm
60.6 mm
47.0 mm
135
O
Max 2.2 mm
Component
Height
No
component
this Area
Air Flow
Содержание Intel E7230 MCH
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Страница 12: ...Packaging Technology 12 Intel E7230 Chipset Memory Controller Hub MCH Thermal Mechanical Design Guide...
Страница 14: ...Thermal Specifications 14 Intel E7230 Chipset Memory Controller Hub MCH Thermal Mechanical Design Guide...
Страница 16: ...Thermal Simulation 16 Intel E7230 Chipset Memory Controller Hub MCH Thermal Mechanical Design Guide...
Страница 20: ...Thermal Metrology 20 Intel E7230 Chipset Memory Controller Hub MCH Thermal Mechanical Design Guide...
