Intel
®
Core™ 2 Duo Processor and Intel
®
Core™ Duo Processor with Intel
®
E7520 Chipset Development Kit
January 2007
User’s Manual
Order Number: 316068-001US
25
Intel
®
Core™ 2 Duo Processor and Intel
®
Core™ Duo Processor with Intel
®
E7520 Chipset
Development Kit
3.0
Theory of Operation
3.1
Block Diagram
3.2
Thermal Management
The objective of thermal management is to ensure that the temperature of each
component is maintained within specified functional limits. The functional temperature
limit is the range within which the electrical circuits may be expected to meet their
specified performance requirements. Operation outside the functional limit may
degrade system performance and cause reliability problems. The development kit
shipped with heatsink thermal solution to be installed on the processor. This thermal
solution has been tested in an open air environment at room temperature and is
sufficient for evaluation purposes. The designer must ensure that adequate thermal
management is provided for any customer-derived designs.
Figure 13. Block Diagram of Layout