Additional Information
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Revision 6.0
2020-11-12
Recommendations for Board Assembly of Infineon Quad Flat
Packages
Package Description
1
Package Description
This recommendation provides information about the board assembly of Infineon Quad Flat Packages (QFP) by
Surface Mount Technology (SMT). The typical gullwing leads are arranged on all four sides of the package mold
body. An exposed die pad in the center of the package landing allows for optimum heat transfer and electrical
grounding. The reliable setup and high lead count of QFP makes them ideal carriers for microcontroller or gate
driver Integrated Circuits (IC).
This document does not discuss other Infineon dual row packages with gullwing leads. These package families
are described in a separate document.
1.1
QFP Package Type
Infineon QFP come with different total heights and lead pitches. The typical pitch of Low-profile Quad Flat
Packages (LQFP) and Thin Quad Flat Packages (TQFP) is of 0.5 mm. The latter also provides a pitch down to
0.4 mm. Metric Quad Flat Packages (MQFP) have a typical pitch of 0.65 mm up to 0.8 mm.
representatives of the QFP package families.
PG-LQFP
PG-MQFP
PG-TQFP
PG = Plastic Green
L = Low-profile
M = Metric
T = Thin
QFP = Quad Flat Package
Figure 1
Examples of QFP packages.
1.2
Package Features and General Handling Guidelines
General Handling Guidelines
Semiconductor devices are sensitive to excessive electrostatic discharge (ESD), certain moisture levels,
mechanical handling, and contamination. Therefore, they require specific precautionary measures to ensure
that they are not damaged during transport, storage, handling, and processing.
For further information about component handling, please refer to the
General Recommendations for Board
Assembly of Infineon Packages
document that is available on the Infineon web page [1]. Please also feel free to
contact your local sales, application, or quality engineer.
