Additional Information
18 of 20
Revision 6.0
2020-11-12
Recommendations for Board Assembly of Infineon Quad Flat
Packages
References
7
References
[1]
Infineon: Packages.
[2]
International Electrotechnical Commission: IEC 60068-2-58. Environmental testing - Part 2-58: Tests -
Test Td: Test methods for solderability, resistance to dissolution of metallization and to soldering heat of
surface mounting devices (SMD).
[3]
Electronic Components Industry Association, Assembly and Joining Processes and JEDEC Solid State
Technology Association Committee: EIA/IPC/JEDEC J-STD-002. Solderability Tests for Component Leads,
Terminations, Lugs, Terminals and Wires.
[4]
JEDEC Solid State Technology Association: IPC/JEDEC J-STD-020. Moisture/Reflow Sensitivity
Classification for Nonhermetic Surface Mount Devices.
[5]
JEDEC Solid State Technology Association: IPC/JEDEC J-STD-033. Handling, Packing, Shipping and Use of
Moisture/Reflow Sensitive Surface Mount Devices.
[6]
Association Connecting Electronics Industries: IPC-A-610. Acceptability of Electronic Assemblies.
