Additional Information
13 of 20
Revision 6.0
2020-11-12
Recommendations for Board Assembly of Infineon Quad Flat
Packages
PCB Assembly
the opposite direction will elongate the solder joints, unlike joints on the top side, where gravity will force the
components closer to the PCB surface. This shape will be frozen during cooling and therefore will result in a
higher stand-off on the bottom side after the reflow process. Heavy vibrations in a reflow oven may cause
devices to drop off the PCB.
For further information about reflow soldering, please refer to the
General Recommendations for Board
Assembly of Infineon Packages
document that is available on the Infineon web page [1]. Please also feel free to
contact your local sales, application, or quality engineer.
