Additional Information
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Revision 6.0
2020-11-12
Recommendations for Board Assembly of Infineon Quad Flat
Packages
Inspection
board pad size, the via and stencil layout, the solder paste, and the reflow profile. For thermal evaluations, the
entire thermal path must be considered as well as all boundary conditions such as the application environment
or the electrical use of the component.
Figure 9
X-ray photograph of a properly soldered QFP. The I/O lead solder joints as well as the
exposed pad solder joint including vias-in-pad are visible.
