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IMDES CREATIVE SOLUTIONS
9
1.9
HEAT LEVEL ADJUSTMENT METHOD
The above described procedure of the
JUMBO-CONDENS-
IT
condensation soldering machine works according to
the “HEAT LEVEL ADJUSTMENT METHOD”.
Refer the picture below.
Step 1
The heat transfer fluid (Galden) is not active.
1) The circuit boards are in the process chamber, a few centimetres above the heat transfer liquid at the bottom of
the process chamber.
2) Transfer liquid is heated to the boiling point.
Step 2
The heat transfer liquid (Galden) is active.
It boils at 230 °C and is in active phase.
PCB with components is in the condensation vapour at 230 ° C.
(Galden LS 230 boils at 230 ° C for lead-free applications.)
1) The liquid starts to evaporate and the vapour starts to rise to the assembled PCB.
2) The PCB surface will condense the vapour, because it has a lower temperature than the vapour.
3) Once the PCB temperature equals that of the vapour, the reflow process will take place.
4)
The reflow soldering time will take between 60 to 90 seconds and the total cycle time including loading, processing, cooling
and unloading will be approx. 10 minutes.