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IMDES CREATIVE SOLUTIONS
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Step 3
1) Temperature of the assembled PCB reaches temperature of the transfer fluid.PCB temp. =Vapour temp.
2) Vapour starts to rise again.
Step 4
1) Reflow process will be terminated by switching off the heating elements.
2) Blowers placed under the process chamber will start to cool the process chamber and its transfer medium
Step 5
1) After the cooling process, the PCB can be removed