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IMDES CREATIVE SOLUTIONS 

 

24 

 

 

 

3.1 Lead-free soldering  

 
With conventional soldering technologies there are substantial problems when using lead-free solder alloys in the 

production for lead-free SMD products. Although neither the handling nor the use of lead-free pastes is the actual 
problem. Any bad wetting behavior may be counteracted by installing suitable inert gas equipment and by using 

suitable fluxes. However, the components, potting compounds, printed circuit boards, plastics, etc., simply do not 
meet any more the required conditions for a lead-free soldering process. All boundary parameters are infringed 
upon, i.e. maximum temperature, time above liquids, maximum dwell times in the oven, etc. With convection 

machines all the process limits have been reached. The air temperatures may not be increased further because this 
would exceed the maximum temperatures and the temperature differences on the printed circuit board. Neither 

may the machines be lengthened further as this would increase the times above flow point temperature and the 
maximum dwell times. Even an increase in the speed of the air-flow is out of question as this will displace the 

components. Thus, in mass production one may be forced – if one maintains the present soldering technology, to 
tailor any critical materials to the process. However, from today’s point of view this results in enormous 
complications and overhead. Contrary to the costs of the pastes, which represent only a fraction of the costs of the 

assembly – a doubling of the costs of the components increases the actual production costs enormously. This, 
consequently, will create a substantial problem in earning capacity. It is here where the vapor-phase - as the only 

soldering system - offers the inestimable advantage to continue using all hereto known and processed materials. 
The costs of the machines are comparable and in some cases even lower than those of well-known convection 
systems. Therefore, the vapor-phase offers enormous competitive advantages in the production of lead-free 

products.  
 

Profile of paste containing lead. 200 °C end temperature  
Profile of paste without lead. 230 °C end temperatur

e  

 

3.2 Void-free soldering  

 
A critical property of solder-joints - from certain sizes onwards, is to form voids, which may lead to functional 
problems and questions as to their durability. E.g. the solder-joints of high-capacity processors may not dissipate 

their waste-heat correctly any more. Often only a fraction of the capacity of high capacity thyristors may be used. 
Yet, the trend continues towards even higher integrated circuits with power components on the printed circuit 

boards. All this requires furthering reducing the formation of voids. The vapor-phase process offers inestimable 
possibilities to reduce drastically the formation of voids. Studies have verified that assemblies, which have been 
processed in a vapor-phase system, produce only a fraction of voids -compared to infrared or convection processed 

boards. The reason for the small amount of voids is the absolutely oxygen-free vapor-phase soldering process. As 
soon as there is an oxide film on the molten alloy, it is like a skin which inhibits the escape of the voids out of to 

the solder-joint. This void behavior is problematic and particularly so with lead-free soldering. Due to the bad 
wetting of the pastes the voids are not able to escape the soldering alloy. However, when soldering in a vapor-

phase system voids the behavior that corresponds to that of convection soldering with lead containing pastes. 
Generally, lead-free pastes are inclined to produce very high amounts of voids in standard convection machines.  
 

 

 

Содержание DINO-CONDENS-IT

Страница 1: ...van Stralen 2019 IMDES CREATIVE SOLUTIONS 1 DINO CONDENS IT PROFILER The perfect method to solder SMD components at the highest solder quality Preliminary Owner s Manual Version 2 0Tuesday February 5...

Страница 2: ...nical inaccuracies or typographical errors Information may be changed or updated without notice IMDES CREATIVE SOLUTIONS may make improvements and or changes in the materials machine at any time witho...

Страница 3: ...1 13 2 Installation and commissioning 13 1 13 3 The stainless steel lid with glass observation window 13 1 14 Handling Tips 14 1 14 1 Handling of the DINO CONDENS IT 14 1 14 2 General operating instru...

Страница 4: ...th without N2 Vapor Phase 26 4 1 5 Bridging short circuits or bridges between pads 26 4 1 6 Solder Beads 26 4 1 7 Pop Corning 28 4 1 8 Poor Wetting 28 4 1 9 Voiding 28 5 0 Double Sided Printed Circuit...

Страница 5: ...hall NOT be exceeded under any circumstances 1 1 Technical Data Power Supply Single phase 220 240 Volt 50 60 Hz Power Connector Three Prong Power Connector Max heating capacity 2500 Watt ca 12 A Dimen...

Страница 6: ...the same temperature as the boiling liquid When the assembled printed circuit boards is brought into this space the vapor will condense on the surface because the circuit board has a lower temperatur...

Страница 7: ...ed Circuit Boards with SMD components are were mostly done in an infrared oven possibly with nitrogen as shielding gas to prevent oxidization of solder joints On the introduction of lead free solderin...

Страница 8: ...B regardless of the shape or colour Absolute uniform heating of the PCB Condensation vapour causes a thin liquid film that penetrates to the smallest openings resulting in reliable soldering of BGAs a...

Страница 9: ...d at the bottom of the process chamber 2 Transfer liquid is heated to the boiling point Step 2 The heat transfer liquid Galden is active It boils at 230 C and is in active phase PCB with components is...

Страница 10: ...0 Step 3 1 Temperature of the assembled PCB reaches temperature of the transfer fluid PCB temp Vapour temp 2 Vapour starts to rise again Step 4 1 Reflow process will be terminated by switching off the...

Страница 11: ...ess chamber cover sensor A micro switch monitors if the process chamber cover is present and closed If you open the cover before the end of the process the system is switched off When the there is no...

Страница 12: ...ch DINO CONDENS IT Item FLEX DINO CONDENS IT 1 no Lid Cover with glass window 1 no This owner s manual 1 no AC Power cable 1 no Dipstick to measure the Galden Level in the process chamber 1 no Pump 10...

Страница 13: ...hange of air underneath the DINO CONDENS IT 1 13 3 The stainless steel lid with glass observation window GALDEN is an expensive liquid and hence we have optimized the DINO CONDENS IT to have the lowes...

Страница 14: ...right away 1 14 1 Handling of the DINO CONDENS IT With the construction of DINO CONDENS IT great attention was given to a simple reliable and straightforward design for ease of handling and low cost...

Страница 15: ...without prior consultation with IMDES CREATIVE SOLUTIONS Use personal protection while operating the system Observe all applicable national regulations and safety regulations for accident prevention a...

Страница 16: ...rning GALDEN decomposes when heated above 295 C 563 F into harmful components The DINO CONDENS IT does NOT check automatically if there is sufficient level of GALDEN in the process chamber Therefor yo...

Страница 17: ...move the soldered part and product carrier We strongly discourage the use of pliers tweezers or similar tools to remove the soldered parts as they may slip from the tool and fall into the liquid Galde...

Страница 18: ...n this zone The work piece surface is heated to the temperature of the boiling liquid vapour The temperature of the vapor is determined by the temperature of the boiling point of liquid and will not e...

Страница 19: ...s IMDES CREATIVE SOLUITIONS Copy right Paul Keizer Ver 1 15 or an other Ver Version release No When pressing the green key the soldering process starts with the last saved profile in Eeprom and starts...

Страница 20: ...and red key simultaneously to enter the next menu If you want to activate the Anti tombstone mode you must enter values into the AntiTombStTime Menu If you do not want to change anything in a menu yo...

Страница 21: ...low modus the machine is continually sensing the Galden Temperature and automatically switch of de heaters and starting the cool down if the Galden temperature exceeds its limits ANTI TOMBSTONE REFLOW...

Страница 22: ...pressing the plunger of the syringe 9 Repeat the procedure until process chamber is empty 10 When the process chamber is empty place the DINO CONDENS IT in horizontal position 11 The DINO CONDENS IT...

Страница 23: ...from the delivery date The warranty is void if The machine is not operated as per the procedure detailed here in and or operated without the liquid Galden filled in the process chamber If any modific...

Страница 24: ...em in earning capacity It is here where the vapor phase as the only soldering system offers the inestimable advantage to continue using all hereto known and processed materials The costs of the machin...

Страница 25: ...oo high Generally due to the careful heating with vapor phase soldering the solder ball formation is greatly reduced 4 1 2 Wicking Effect The wicking effect is the rise of the molten solder on compone...

Страница 26: ...far apart to prevent the surface tension of the solder to pull the component to one side This will make it impossible to produce a solder contact on its other side due to an insufficient contact area...

Страница 27: ...is oxidation influence may be well observed in convection machines Switching off the nitrogen supply is a frequently used trick to eliminate tombstoning with known failure prone assemblies Without nit...

Страница 28: ...The dangerous of the popcorn effect is that it is not immediately detected as it occurs under the device for example are BGAs Vapor phase soldering significantly reduces this error probability 4 1 8...

Страница 29: ...costs As the adhesives are cured without oxygen no oxides will form on the printed circuit boards which results in improved solder quality Advantage of having a single profile to cure adhesive and to...

Страница 30: ...inly laid out designed with small chips 7 2 Step 1 We start with Screen printing the B side of the double side PCB with smallest components Placing the components Reflowing PCB Side B with the compone...

Страница 31: ...f the A side with large components To screen the A side of the PCB you need to use a PCB support holder Use for the PCB support holder material that is thicker than the populated PCB and thick enough...

Страница 32: ...ndoffs See Fig below You ll damage the SMT solder joints from the first reflow if you lay the board directly on the product carrier Standoffs You can use any material that can withstand the condensati...

Страница 33: ...OLUTIONS Schulstrasse 21 D 48455 Bad Bentheim Gildehaus Germany T 49 0 5924 997337 E info imdes de www imdes de SKYPE marc van Stralen 2019 IMDES CREATIVE SOLUTIONS 33 7 6 DUAL SIDED MIXED SMD THT ASS...

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