Imdes DINO-CONDENS-IT, Руководство пользователя

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IMDES CREATIVE SOLUTIONS Schulstrasse 21 D-48455 Bad Bentheim /Gildehaus Germany T:+49(0)5924-997337 E: info@imdes.de
www.imdes.de SKYPE marc.van Stralen © 2019 IMDES CREATIVE SOLUTIONS
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1. Introduction
Thank you for purchasing our IMDES DINO-CONDENS- IT , the compact reflow soldering machine.
This compact device is sufficient for most reflow solder purposes and is able to accept PCB´s up to double Euro
Card size.
Please read the entire instruction manual, before operating the unit safely and optimally.
The operation is basically very simple, but one shall always work with trained people or people who
are familiar with this machine.
With careful maintenance and proper operations you will be able to enjoy the benefits of this machine for many
years.
The system is intended for the soldering of printed circuit boards or ceramic substrates with leadless components
(SMD) up to a temperature of 240 °C (464 °F).
Other applications are not permitted .
The operating safety of DINO-CONDENS-
IT
supplied is guaranteed only when used as directed.
The limits specified in the technical data shall NOT be exceeded under any circumstances.
1.1 Technical Data:-
Power Supply Single phase 220-240 Volt / 50-60 Hz
Power Connector Three Prong Power Connector
Max. heating capacity 2500 Watt (ca. 12 A)
Dimensions. 840 x 640 x 460 mm
(L x W x H)
max. solder product format 580 x 460 x 20 mm (
L x Wx H)
Standard cycle time 15-25 Minutes (including heating up & cooling down )
Standard Reflow Time (
TAL Time Above Liquids)
3 – 50 Seconds (max 70 Seconds)
Process temperature
(depends on medium type)
150 °C up to 240 °C
= 302 °F up to 464° F
Weight 12 kg
Solder Profiles Adjustable temperature profiles in the pre-heating zone(CVPRS*)
TAL Time Above Liquid Adjustable TAL Time Above Liquid
ATS Anti Tomb Stone modus (ATS)
Micro USB interface for the transfer of solder profile data to PC
Cooling Forced Air cooling down to 70°C = 158°F
Storage Temperature -1°C to +70 °C 30,2 °F to 158°F
Heat Transfer Medium GALDEN LS
with the boiling temperature as needed
(max. 240 °C max. 464 ° F)
Medium basic filling quantity ca. 1648 ml (1.65 Liter) 3 Kg GALDEN
1.2 Scope of the DINO-CONDENS-
IT
:
 Soldering of single pieces and small numbers of SMD PCB’s.
 Safe and high quality (lead-free) soldering of SMD prototypes PCB’s.
 Quality control printed circuit boards and solder pastes.
 Repair (de-soldering and soldering) of SMD components (large).