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603 Hardware Specifications, REV 2

Preliminary—Subject to Change without Notice

Appendix A

General Handling Recommendations for the

IBM Package

The following list provides a few guidelines for package handling:

•

Handle the electrostatic discharge sensitive (ESD) package with care before, during, and after
processing.

•

Do not apply any load to exceed 3 Kg after assembly.

•

Components should not be hot dip tinned

•

The package encapsulation is an acrylated urethane. Use adequate ventilation (local exhaust) for all
elevated temperature processes.

The package parameters are as follows:

Heat sink adhesive

AIEG-7655

IBM reference drawing

99F4869

Test socket

Yamaichi QFP-PO 0.5-240P

Signal

165

Power/ground

Total

240

A.1 Package Environmental, Operation, Shipment,

and Storage Requirements

The environmental, operation, shipment, and storage requirements are as follows:

•

Make sure that the package is suitable for continuous operation under business office environments.

— Operating environment: 10

C to 40

C, 8% to 80% relative humidity

— Storage environment: 1

C to 60

C, to 80% relative humidity

— Shipping environment: 40

C to 60

C, 5% to 100% relative humidity

•

This component is qualified to meet JEDEC moisture Class 2 of bag

— After expiration of shelf life, packages may be baked at 120

C (+10/–5

C) for 4 hours

minimum and packaged. Shelf life is as specified above.

Содержание MPC603EC

Страница 1: ...ocessor is an implementation of the PowerPC family of reduced instruction set computer RISC microprocessors This document contains pertinent physical characteristics of the 603 For functional characte...

Страница 2: ...ndependent on chip 8 Kbyte two way set associative physically addressed caches for instructions and data and on chip instruction and data memory management units MMUs The MMUs contain 64 entry two way...

Страница 3: ...m 8 Kbyte instruction cache two way set associative physically addressed LRU replacement algorithm Cache write back or write through operation programmable on a per page or per block basis BPU that pe...

Страница 4: ...ble 1 and Table 2 provide the absolute maximum ratings thermal characteristics and DC electrical characteristics for the 603 Table 1 Absolute Maximum Ratings Characteristic Symbol Value Unit Supply vo...

Страница 5: ...ate leakage current Vin 3 465 V1 Vin 5 5 V1 ITSI 10 A ITSI TBD A Output high voltage IOH 9 mA VOH 2 4 V Output low voltage IOL 14 mA VOL 0 4 V Capacitance Vin 0 V f 1 MHz2 excludes TS ABB DBB and ARTR...

Страница 6: ...Typical 2 0 mW 2 1 Typical 2 0 2 0 mW Note 1 The values provided for this mode do not include pad driver power OVDD or analog supply power AVDD Worst case AVDD 15 mW Table 5 Clock AC Timing Specificat...

Страница 7: ...LK are reached during the power on reset sequence This specification also applies when the PLL has been disabled and subsequently re enabled during sleep mode Also note that HRESET must be held assert...

Страница 8: ...for DRTRY QACK and TLBISYNC 0 0 0 0 0 ns 4 6 7 Notes 1 All input specifications are measured from the TTL level 0 8 or 2 0 V of the signal in question to the 1 4 V of the rising edge of the input SYSC...

Страница 9: ...CLK frequencies Table 7 Output AC Timing Specifications Vdd 3 3 5 V dc GND 0 V dc CL 50 pF 0 TJ 105 C Num Characteristic 25 33 33 40 50 66 67 Unit Notes Min Max Min Max Min Max Min Max Min Max 12 SYSC...

Страница 10: ...s are measured from the 1 4 V of the rising edge of SYSCLK to the TTL level 0 8 V or 2 0 V of the signal in question Both input and output timings are measured at the pin See Figure 4 2 All maximum ti...

Страница 11: ...ions REV 2 11 Preliminary Subject to Change without Notice Figure 4 Output Timing Diagram SYSCLK 12 14 13 15 16 16 ALL OUTPUTS Except TS ABB TS ARTRY ABB DBB VM VM VM Midpoint Voltage 1 4 V DBB ARTRY...

Страница 12: ...k pulse width measured at 1 4 V 25 ns 3 TCK rise and fall times 0 3 ns 4 TRST setup time to TCK rising edge 13 ns 1 5 TRST assert time 40 ns 6 Boundary scan input data setup time 6 ns 2 7 Boundary sca...

Страница 13: ...ary scan timing diagram Figure 7 Boundary Scan Timing Diagram Figure 8 provides the test access port timing diagram Figure 8 Test Access Port Timing Diagram 4 5 TRST TCK 6 7 Input Data Valid 8 9 8 Out...

Страница 14: ...152 151 150 149 148 147 146 145 144 143 142 141 140 139 138 137 136 135 134 133 132 131 130 129 128 127 126 125 124 123 122 121 OVDD GND OGND CI WT QACK TBEN TLBISYNC RSRV AP0 AP1 OVDD OGND AP2 AP3 CS...

Страница 15: ...I O AVDD 209 High Input BG 27 Low Input BR 219 Low Output CI 237 Low Output CLK_OUT 221 Output CKSTP_IN 215 Low Input CKSTP_OUT 216 Low Output CSE 225 High Output DBB 145 Low I O DBDIS 153 Low Input...

Страница 16: ...28 138 148 163 173 183 194 222 229 240 High Input PLL_CFG0 PLL_CFG3 213 211 210 208 High Input QACK 235 Low Input QREQ 31 Low Output RSRV 232 Low Output SMI 187 Low Input SRESET 189 Low Input SYSCLK 2...

Страница 17: ...that the 603 is currently offered in two types of CQFP packages the Motorola wire bond CQFP and the IBM C4 CQFP 1 6 1 Motorola Wire Bond CQFP Package Description The following sections provide the pac...

Страница 18: ...chanical Dimensions of the Motorola Wire Bond CQFP Package Reduced pin count shown for clarity 60 pins per side Min Max A 30 86 31 75 B 34 6 BSC C 3 75 4 15 D 0 5 BSC E 0 18 0 30 F 3 10 3 90 G 0 13 0...

Страница 19: ...ameters are as provided in the following list The package type is 32 mm x 32 mm 240 pin ceramic quad flat pack Package outline 32 mm x 32 mm Interconnects 240 Pitch 0 5 mm Lead plating Ni Au Solder jo...

Страница 20: ...Figure 11 Mechanical Dimensions of the IBM C4 CQFP Package Reduced pin count shown for clarity 60 pins per side Min Max A 31 8 32 2 B 34 4 34 8 C 3 05 3 15 D 0 45 0 55 E 0 18 0 28 Clip Leadframe Chip...

Страница 21: ...d should not exceed 200 MHz 2 In PLL bypass mode the SYSCLK input signal clocks the internal processor directly the PLL is disabled and the bus mode is set for 1 1 mode operation This mode is intended...

Страница 22: ...close as possible to their associated Vdd pin Surface mount tantulum or ceramic devices are preferred It is also recommended that these decoupling capacitors receive their power from Vdd and GND powe...

Страница 23: ...he device In this environment it can be assumed that all the heat is dissipated to the ambient through the heat sink so the junction to ambient thermal resistance is the sum of the resistances from th...

Страница 24: ...Thermal resistance junction to heat sink R js or js 1 1 C Watt junction to heat sink 1 7 6 2 Thermal Management Example The following example is based on a typical desktop configuration using an IBM...

Страница 25: ...the reliability limits of the device Notes 1 Junction to ambient thermal resistance is based on modeling 2 Junction to heat sink thermal resistance is based on measurements and model using thermal tes...

Страница 26: ...6 provides a detailed description of the IBM part number for the 603 Figure 16 IBM Part Number Key Table 11 Ordering Information for the PowerPC 603 Microprocessor Package Type Internal Frequency Bus...

Страница 27: ...follows Heat sink adhesive AIEG 7655 IBM reference drawing 99F4869 Test socket Yamaichi QFP PO 0 5 240P Signal 165 Power ground 75 Total 240 A 1 Package Environmental Operation Shipment and Storage Re...

Страница 28: ...mbly process no solvent can be used with the C4FP and no more than 3 Kg of force must be applied normal to the top of the package prior to during or after card assembly Other details of the card assem...

Страница 29: ...om side pressure of 44 psig water temperature of 62 5 C 2 5 C dwell time of 48 seconds minimum water flow rate of 350 liters minute Wash chamber 2 top and bottom sprays minimum top side pressure of 32...

Страница 30: ...erty rights nor the rights of others Neither Motorola nor IBM makes any claim warranty or representation express or implied that the products described in this manual are designed intended or authoriz...

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