IBM MPC603EC, Руководство пользователя

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603 Hardware Specifications, REV 2 5
Preliminary—Subject to Change without Notice
Table 3 provides the DC electrical characteristics for the 603.
Table 4 provides the power dissipation for the 603.
Table 3. DC Electrical Specifications
Vdd = 3.3
±
5% V dc, GND = 0 V dc, 0
≤
T
j
≤
105
°
C
Characteristic Symbol Min Max Unit
Input high voltage (all inputs except SYSCLK) VIH 2.2 5.5 V
Input low voltage (all inputs except SYSCLK) VIL GND 0.8 V
SYSCLK input high voltage CVIH 2.4 5.5 V
SYSCLK input low voltage CVIL GND 0.4 V
Input leakage current, Vin = 3.465 V
1
Vin = 5.5 V
1
Iin — 10
µ
A
Iin — TBD
µ
A
Hi-Z (off-state) leakage current, Vin
=
3.465 V
1
Vin
=
5.5 V
1
ITSI — 10
µ
A
ITSI — TBD
µ
A
Output high voltage, IOH = –9 mA VOH 2.4 — V
Output low voltage, IOL
= 1 4
mA VOL — 0.4 V
Capacitance, Vin = 0 V, f = 1 MHz
2
(excludes TS, ABB,
DBB, and ARTRY)
Cin — 10.0 pF
Capacitance, Vin = 0 V, f = 1 MHz
2
(for TS, ABB, DBB, and
ARTRY)
Cin — 15.0 pF
Notes : 1. Excludes test signals (LSSD_MODE, L1_TSTCLK, L2_TSTCLK, and JTAG signals). For detailed
leakage information, please contact your local Motorola or IBM sales office.
2. Capacitance is periodically sampled rather than 100% tested.
Table 4. Power Dissipation
Vdd = 3.3
±
5% V dc, GND = 0 V dc, 0
≤
T
j
≤
105
°
C
CPU Clock:
SYSCLK
Bus Frequency (SYSCLK)
Unit
25 MHz 33 MHz 40 MHz 50 MHz 66 MHz
Full-On Mode
Typical
1:1
Max.
1.8 W
2.5 W
Typical
2:1
Max.
1.8 2.0 W
2.5 2.9 W
Doze Mode
1
1:1 Typical 740 mW
2:1 Typical 745 800 mW