IBM MPC603EC, Руководство пользователя

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4 603 Hardware Specifications, REV 2
Preliminary—Subject to Change without Notice
1.2 General Parameters
The following list provides a summary of the general parameters of the 603.
Technology 0.5
µ
CMOS (four-layer metal)
Die size 11.5 mm x 7.4 mm
Transistor count 1.6 million
Logic design Fully-static
Max. internal frequency 80 MHz
Max. bus frequency 66.67 MHz
Package Surface mount, 240-pin CQFP
Power supply 3.3
±
5% V dc
For ordering information, refer to Section 1.8, “Ordering Information.”
1.3 Electrical and Thermal Characteristics
This section provides both the AC and DC electrical specifications and thermal characteristics for the 603.
The following specifications are preliminary and subject to change without notice.
1.3.1 DC Electrical Characteristics
Table 1 and Table 2 provide the absolute maximum ratings, thermal characteristics, and DC electrical
characteristics for the 603.
Table 1. Absolute Maximum Ratings
Characteristic Symbol Value Unit
Supply voltage Vdd –0.3 to 4.0 V
Input voltage Vin –0.3 to 5.5 V
Storage temperature range Tstg –55 to 150
°
C
Notes : 1. Functional operating conditions are given in AC and DC electrical specifications. Stresses beyond the
maximum listed may affect device reliability or cause permanent damage to the device.
2. Caution : Input voltage must not be greater than the supply voltage by more than 2.5 V at all times
including during power-on reset.
Table 2. Thermal Characteristics
Characteristic Symbol Value Rating
Motorola wire-bond CQFP package thermal resistance,
junction-to-case (typical)
θ
JC
2.2
°
C/W
IBM C4-CQFP package thermal resistance,
junction-to-heat sink base
θ
JS
1.1
°
C/W
Note: Refer to Section 1.7, “System Design Information,” for more information about thermal management.