Removal and replacement procedures
Maintenance and Service Guide
4–53
✎
The thermal material must be thoroughly cleaned from the surfaces of the heat sink and the system board
each time the fan and heat sink are removed:
■
Thermal paste is used on the processor
1
and the heat sink section
2
that services it.
■
Thermal pads are used on the Northbridge chip
3
and the heat sink section
4
that services it.
■
Thermal pads are used on the graphics subsystem memory module
5
and the heat sink section
6
that
services it.
Replacement thermal material is included with all system board, heat sink, and processor spare part kits.
5. If it is necessary to replace the fan:
a. Remove the four Phillips PM2.0×4.0 screws
1
that secure the fan to the heat sink.
b. Remove the heat sink
2
by lifting it straight up.
Reverse this procedure to install the fan and heat sink.
