b.
Remove the heat sink (2) from the system board.
NOTE:
The thermal material must be thoroughly cleaned from the surfaces of the heat sink and the system
board components each time the heat sink is removed. Replacement thermal material is included with the
heat sink, processor, and system board spare part kits.
The following illustrations show the replacement thermal material locations.
●
Discrete graphics with fan: Thermal paste is used on the processor (1) and associated heat sink area
(2), as well as the graphics chip (3) and associated heat sink area (4).
Component replacement procedures
59
Содержание 17-x Series
Страница 1: ...HP Notebook PC Intel Models HP 17 x000 17 x099 Maintenance and Service Guide ...
Страница 4: ...iv Safety warning notice ...
Страница 8: ...viii ...
Страница 14: ...6 Chapter 1 Product description ...
Страница 29: ...Display assembly subcomponents Display assembly subcomponents 21 ...
Страница 34: ...26 Chapter 3 Illustrated parts catalog ...
Страница 68: ...60 Chapter 6 Removal and replacement procedures for Authorized Service Provider parts ...
Страница 96: ...88 Chapter 8 Backing up restoring and recovering in Windows 10 ...
Страница 102: ...94 Chapter 10 Specifications ...
Страница 106: ...98 Chapter 11 Power cord set requirements ...
Страница 108: ...100 Chapter 12 Recycling ...
Страница 112: ...104 Index ...