Introduction
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COM-C | Communication Module
DOC021001DG12EN | Revision 12 | English | 2011-06 | Released | Public
© Hilscher, 2002-2011
1.3 Technical
Features
Common Technical Features for COM-C
Small footprint for the host connector with 50 mil grid
Solid mechanical assembly and a massive connection to earth ground by metal blocks spe-
cial design for the requirements of the Modules with fieldbus connector
Two dowels for exact mounting of the Module on the host board
Metal blocks can easily modified for special customer requirements
Front panel can be mounted on the metal blocks that the modules have always the same
front size and covers the fieldbus connector
Easy to use dual-port memory interface, with additional serial and diagnostic interface
Host interface is designed for 16 KByte address space of the dual-port memory with 8 bit bus
width.
3.3 V power supply reduce power consumption
Available in extended temperature specification
With the COM-C we have a much more compact form factor and additional technical features as
the already established COM Modules.
Extremely compact size 30 x 70 mm
Available with angled and without fieldbus connector
All fieldbus connectors are placed on one side, which is the edge side on the host board to
reserves space
2.5 mm space below the Module available for SMD components on the host board
Now you can have only one type of base board (for each COM family) on stock and you can mount
the requested fieldbus interface short before shipment to the customer. This gives much more
flexibility and saves money even if you have same mechanical constraints (for each COM family) in
comparison to our existing COM Modules. Therefore we have Modules with angled, straight and
without fieldbus connectors:
COM-CA COM-C Modules with angled fieldbus connector
COM-CN COM-C Modules without fieldbus connector
