Type of COM-C Modules
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COM-C | Communication Module
DOC021001DG12EN | Revision 12 | English | 2011-06 | Released | Public
© Hilscher, 2002-2011
2.1.2
Mechanical Dimensions of COM-C Modules
The COM-C Module has a board size of 30 x 70 mm. The maximum height of the components at
the top side of the printed circuit board is 14.0 mm including the fieldbus connector. Keep the
space of 14.0 mm above the top side free.
At the bottom side the maximum height is 4.0 mm, therefore you have 2.5 mm space for compo-
nents on the host board below the Module. The power dissipation in that area should be less than
330 maw!
For further Module development please reserve additional 10 mm space behind the Module. There
are a few larger fieldbus interfaces which do not fit on the small board space. In that case a second
printed circuit board will be mounted on top of the Module and the 10 mm space is necessary for
the connection with flex stripe between these boards.
The general dimensions of the COM-C Modules are shown on the following drawings:
M0200374 General Mechanical dimension of COM-CA-XXX
M0200464 Mechanical dimension of COM-CN-XXX
M0300632 Mechanical dimension of light pipe of COM-CA-XXX
M0400353 Mechanical dimension of Front Plate and Connector of COM-CA-XXX (part 1)
M0400363 Mechanical dimension of Front Plate and Connector of COM-CA-XXX (part 2)
