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Component specifications
For components compatible with the server and detailed component information, visit the query tool
at
http://www.h3c.com/cn/Service/Document_Software/Document_Center/Server/
About component model names
The model name of a hardware option in this document might differ slightly from its model name
label.
A model name label might add a prefix or suffix to the hardware-coded model name for purposes
such as identifying the matching server brand or applicable region. For example, the
DDR4-3200-16G-2Rx8-R memory model represents memory module labels including
UN-DDR4-3200-16G-2Rx8-R, UN-DDR4-3200-16G-2Rx8-R-F, and UN-DDR4-3200-16G-2Rx8-R-S,
which have different prefixes and suffixes.
Processors
Table 11 Intel Ice Lake processor model suffixes
Suffix
Description
N
NFV Optimized
T
High T case
U
Single Socket
V
SaaS Optimized SKU for orchestration efficiency targeting high density, lower power VM
environment (70% CPU utilization)
P
laaS optimized SKU for orchestration efficiency targeting higher frequency for VM Markets
(70% CPU utilization)
Y
Speed Select Technology – Performance Profile
S
Max SGX enclave size SKUs (512GB)
Q
Liquid cooling(Temperature Inlet to cold plate = 40
℃
, ICX TTV
Ψ
ca (case-to-fluid inlet
resistance)=0.06
℃
/W)
M
Media Processing Optimized
NOTE:
The list is for reference only. For detailed information, see the official website of Intel.
DIMMs
The server provides eight DIMM channels per processor and each channel has two DIMM slots. If
the server has one processor, the total number of DIMM slots is 16. If the server has two processors,
the total number of DIMM slots is 32. For the physical layout of DIMM slots, see "