H3C S5820X-28C, Руководство по установке

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1-15
Figure 1-8
The S5820X-28S cooling system air flow diagram
(2)
(3) (4)
(2)
(1)
(1) Front panel (2) Ventilations
(3) Air outlet of the turbo fan (4) Air outlets of the power fan trays
The S5820X-28C adopts a 2U chassis, using independent air channels on the upper layer and lower
layer respectively for heat dissipation. Keep the air channels with good ventilation when the switch is
operating.
z
The heat dissipation process of the lower layer of the device is as shown in Figure 1-9 . Air enters
from the ventilations on one side of the chassis, carries the heat generated by the switch and power
modules, and then goes out from the air outlets of the hot swappable fan and power module fan.
z
The heat dissipation process of the upper layer of the device is as shown in Figure 1-10 . Air enters
from the ventilations on one side of the chassis, carries the heat generated by the switch, the OAP
card, and the Interface Cards , and then goes out from the air outlets of the hot swappable fan and
power module fan.