RWB II PLUS MICROPROCESSOR CONTROL
OPERATION - MAINTENANCE
S70-200 OM
Page 2
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Contents
MICROPROCESSOR CONTROL PANEL .................................................................................................................................... 3
KEYS AND KEY FUNCTIONS ...................................................................................................................................................... 4
TO CHANGE THE ADJUSTABLE SETPOINTS: ........................................................................................................................... 6
HOW TO DETERMINE ADJUSTABLE SETPOINTS: ................................................................................................................... 7
TEMPERATURE-PRESSURE CONTROL PROGRAM (OPTION) ............................................................................................. 10
LEAD-LAG OPTION .................................................................................................................................................................... 12
COMMUNICATIONS TROUBLESHOOTING .............................................................................................................................. 13
HOW THE MICROPROCESSOR WORKS - SUMMARY - .......................................................................................................... 13
MULTIPLE COMPRESSOR SEQUENCING ............................................................................................................................... 14
SUGGESTED PROGRAMMABLE CONTROLLER PROGRAM TO DECODE
MICROPROCESSOR OUTPUT DATA CODES ................................................................................................................... 14
MICROPROCESSOR OUTPUT DATA CODE ............................................................................................................................. 15
MICROPROCESSOR TELECOMMUNICATIONS ...................................................................................................................... 16
COMMUNICATIONS PROTOCOL SPECIFICATIONS: ............................................................................................................... 16
TROUBLESHOOTING THE RWB II PLUS MICROPROCESSOR .............................................................................................. 20
GENERAL INFORMATION ......................................................................................................................................................... 20
TROUBLESHOOTING FRICK SBC MICROPROCESSOR SYSTEM ........................................................................................ 20
TESTING MICRO-PANEL ALARMS/CUTOUTS ......................................................................................................................... 23
EPROM MEMORY I/C CHIP REPLACEMENT ........................................................................................................................... 25
SBC BOARD REPLACEMENT ................................................................................................................................................... 25
MICROPROCESSOR DISPLAY REPLACEMENT ...................................................................................................................... 25
OUTPUT FUSE REPLACEMENT ............................................................................................................................................... 25
SBC WIRING DIAGRAM ............................................................................................................................................................. 26
POINT-TO-POINT FIELD WIRING DIAGRAM ............................................................................................................................ 26
MICRO COMPONENT PLACEMENT DIAGRAM ....................................................................................................................... 27
RWB II PLUS TELECOMMUNICATIONS ................................................................................................................................... 27
MICROPANEL ASSEMBLY WIRING DIAGRAMS ....................................................................................................................... 28
RECOMMENDED SPARE PARTS - CURRENT DESIGN .......................................................................................................... 32
