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WinFTM
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Integrated Technology Features of WinFTM BASIC and LIGHT
2 Features of WinFTM BASIC and LIGHT
The following section describes the features of the software versions BASIC and LIGHT.
If there are restrictions in the LIGHT version, they are indicated in the text.
2.1 Integrated Technology

Coating thickness measurement and material analysis can be performed in one run.

Both operate standard-free as well.
2.2 Measurements Independent of the Substrate Material

During the measurement the substrate material is analyzed automatically. Thus, mea-
surements on different substrate materials can be performed without normalization in
many cases. This makes work much easier and saves time.
The reliability of the measurement result is increased, because the coating thickness
is measured correctly, even with hidden changes of the substrate material.
Even materials underneath the top coating can be analyzed without removing the top
coating.

Function for taking into account the spectral background. The user can define the
spectral background in the Def.MA. This function increases the accuracy of the analy-
sis as long as a suitable underground spectrum is available.
2.3 Coating Thickness Measurement
With the BASIC version max. 24 individual parameters of a specimen can be measured
(thickness, composition, element).
Examples:

A component is to be measured, that has 24 layers each consisting of one element.

A component is to be measured, that has one coating, which consists of a mixture of
24 elements.