FE CC-M, Инструкция по эксплуатации

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INP-TN512878-E
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INTRODUCTION·····················································································································i
SAFETY PRECAUTIONS·······································································································ii
CONTENTS····························································································································· v
FOREWORD ·························································································································vii
1. GENERAL PRECAUTIONS ON COMPACT CONTROLLER (CC-M)·························· 1
1.1 Precautions for use of wafers ·································································································1
1.2 Correspondence of external signals and internal signals························································1
1.3 Contents of internal arithmetic operations ·············································································2
1.4 Modes and output signals of controller ··················································································3
1.5 Control output bumpless changeover ·····················································································4
2. BALANCELESS, BUMPLESS CIRCUIT AT THE TIME OF MODE CHANGE
OF CONTROLLER MODE (CASE OF FROM A-MODE TO R-MODE) ······················· 5
2.1 Case where R-SV is an external signal (manual bumpless changeover)·····························5
2.2 Case where R-SV is an internal signal (caser where primary PID control and
secondary PID control are used) ····························································································5
2.2.1 Bumpless changeover circuit of ordinary cascade control·······································5
2.2.2 Bumpless changeover circuit with inverse arithmetic operation function ···············6
2.2.3 Bumpless changeover circuit using primary integration circuit·······························7
2.2.4 Bumpless changeover circuit using pulse width integration wafer (06) ··················8
3. HOW TO HOLD OUTPUT VALUE (MV) ······································································· 9
3.1 Method to input external signal (forced manual SMAN)·······················································9
3.2 Method to input external signal (EX-MV) ·············································································9
3.3 Method to stop addition of
∆
MV value··················································································9
4. METHOD FOR MATERIALIZATION OF VARIOUS FUNCTIONS USING
WAFERS OF VARIOUS TYPES ···················································································· 10
4.1 How to use changeover wafer (67)·······················································································10
4.1.1 Analog signal hold circuit······················································································10
4.1.2 Sample hold circuit using pulse generation wafer ·················································10
4.1.3 R · S flip-flop circuit (RESET priority) ·································································11
4.1.4 Changeover of digital signal ··················································································11
4.2 Creation of one-shot multiple circuits (method to use basic period)·································12
4.2.1 Method to seize rise of input··················································································12
4.2.2 Method to seize fall of input ··················································································12
4.2.3 Method using timer and logical wafer ···································································13
CONTENTS