© 2016 EnOcean | www.enocean.com
F-710-017, V1.2 TCM 330 / TCM 330U User Manual | v1.1 | August 2016 | Page 53/62
USER MANUAL V1.1
TCM 330 / TCM 330U
Wireless LED Controller Module
6.3
Layout recommendations
The length of lines connected to I/O pins should not exceed 5 cm (2”).
It is recommended to have a complete GND layer in the application PCB, at least in
the area below the module and directly connected components (e.g. mid-layer of
your application PCB).
Due to non-isolated test points there are live signals accessible on the bottom side
of the module.
Please follow the following advices to prevent interference with your application
circuit:
n
We suggest avoiding any copper structure in the area directly underneath the
module (top-layer layout of your application PCB). If this is not possible in your
design, please provide coating on top of your PCB to prevent short circuits to
the module. All bare metal surfaces including Vias have to be covered (e.g. ad-
equate layout of solder resist).
n
It is mandatory that the area marked by the circle in the drawings below is kept
clear of any conductive structures in the top layer and 0.3mm below. Otherwise
RF performance will be degraded!
n
Furthermore, any distortive signals (e.g. bus signals or power lines) should not
be routed underneath the module. If such signals are present in your design,
we suggest separating them by using a ground plane between module and
these signal lines.
