D
Installation and Handling Instructions
This appendix describes antistatic precautions and installation and
handling instructions for various components of the AXPpci 33 board.
D.1
Antistatic Precautions
Due to electronic component sensitivity to static electricity, anyone
handling the AXPpci 33 MLB or accessory components should wear a
properly grounded antistatic wrist strap. Use of antistatic mats, an
ESD approved workstation, and exercising other good ESD practices is
recommended wherever possible (manufacturing or assembly areas).
D.2
Installation Instructions
The following sections describe installation instructions for various
components of the DECchip 21066.
D.2.1
Heatsink Labeling
No specific heatsink labeling is recommended. However, if labeling
is required, it should be done before heatsink assembly to the Alpha
processor. You may want to transfer date codes or record other markings
from the Alpha processor so that they can be viewed on the fully assembled
MLB.
D.2.2
Grafoil Thermal Pad — Pick and Place
1
Observe antistatic handling precautions.
2
Visually inspect the DECchip 21066 to ensure it is free of
contamination.
3
Pick up the Grafoil thermal pad at the center using a vacuum pick-up
tool. (Do not do this by hand.)
4
Align the Grafoil thermal pad over the threaded studs and place it on
the Alpha chip’s gold-plated surface.
D.2.3
Heatsink Attachment
•
Observe antistatic handling precautions.
•
Align the heatsink holes with the threaded studs on the ceramic
package.
D–1
Содержание AXPpci 33
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