PCI Express
Generation 3
expansion slots
using
expansion card
riser
Specification
(Slot 2) one full-height, half-length x16 link for processor 1
PCIE_G3_X8
(Slot 1) one full-height, half-length x4 link for processor 1
(Slot 2) one half-height, half-length x8 link for processor 1
Memory specifications
Memory
Specification
Architecture
DDR3 UDIMMs that operates at 2133 MT/s.
Support for advanced ECC or memory optimized operation
Memory module
sockets
Four 288-pin sockets
Memory module
capacities
(UDIMM)
4 GB (single-rank), 8 GB (dual-rank), 16 GB (dual-rank)
Minimum RAM
16 GB
Maximum RAM
64 GB
NOTE: For system specific memory details, see Supported configurations section.
Related Links
Supported configurations
Power specifications
Power supply
unit
Specification
Power rating per
power supply unit
(PSU)
250 W (Bronze) AC (100–240 V, 50/60 Hz, 4.0 A-2.0 A)
Heat dissipation
NOTE: Heat dissipation is calculated using the PSU wattage rating.
1039 BTU/hr maximum (250 W PSU)
Voltage
NOTE: This system is also designed to be connected to IT power systems with
a phase-to-phase voltage not exceeding 230 V.
100–240 V AC, autoranging, 50/60 Hz
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