3-1
3
Preparing for Installation
Environment Requirements
The device is designed for indoor application. To ensure the normal operation and prolong the service
life, the installation site must meet the requirements mentioned hereunder.
Temperature and Humidity Requirements
The temperature and humidity in the equipment room shall be maintained at an appropriate level.
A long-time high relative humidity will quite likely result in poor insulation performance, electric
leakage, mechanical property change, and corrosion.
A long-term low relative humidity will result in looseness of fastening screws owing to shrinkage of
insulation washers, or electrostatic discharge (ESD), which may damage the CMOS circuit on the
device.
A high temperature will speed up the aging of insulation materials, which greatly lower the device’s
reliability and shortens the service life.
Table 3-1 lists the requirements on temperature and humidity for the F5000-A5.
Table 3-1
Temperature and humidity requirements in the equipment room
Temperature
Relative humidity
0°C to 45°C (32°F to 113°F)
10% to 95% (noncondensing)
Cleanness Requirements
Concentration limit of dust
Dust is harmful to the safe operation of the device. Dust on the chassis may result in static adsorption,
which causes poor contact between metal connectors or joints. The poor contact not only shortens the
service life of the device, but also brings about communication failures. Especially under the condition
of low indoor humidity, static adsorption is more likely to occur.
Table 3-2 lists the requirements on the dust concentration and diameters in the equipment room.
Table 3-2
Limitation on dust concentration and diameter in the equipment room
Diameter (
μ
m)
0.5
1
3
5
Concentration limit (particles/m³)
1.4 x 10
7
7 x 10
5
2.4 x 10
5
1.3 x 10
5
Concentration limit of harmful gases
Besides, the amounts of salt, acid, and sulfide in the equipment room should be strictly restricted.
Harmful gases could accelerate the corrosion of metal parts and the aging of some parts.
Table 3-3 lists the concentration limit of SO
2
, H
2
S, NH
3
, and CI
2
in the equipment room.
