
• x16 standard card form factor (FHHL), single slot (111.15 mm x 167.65 mm)
• Maintenance port for card maintenance and developer access using the DMB II Interface
(proprietary, requires Xilinx
®
DMB II kit)
Overview
The system hardware contains a single PCB assembly. The MNC2 card is built with a XCZU21DR
Zynq Ult RFSoC and a XCZU19EG Zynq Ult MPSoC. The connectivity includes
two 25G interfaces and one x16 Gen 3.0 PCIe interface. Each SoC acts as a Gen3.0 x8 endpoint
with respect to root complex. One DDR4 Memory controller is implemented inside the PL
section of both SoCs. A second set of DDR4 memory is interfaced to PS section of both SoCs.
One 100G transceiver is implemented on both SoCs for inter-SoC communication. A detailed
block diagram of the T1 card card is shown in the following figure.
Figure 3: Detailed T1 card Block Diagram
Zync Ult
RFSoC
XCZU21DR
-L2FSVD1156E
Zync Ult
MPSoC
XCZU19EG
-L2FFVD1760E
QSPI Flash
Memory
Configuration
Block
IO[0:7]
SCK
CS
DDR4
DDR4_1_A[0:16]
DDR4_1_BA[0:1]
DDR4_1_DM[0:4]
DDR4_1_DQ[0:39]
DDR4_1_A\DQS_T/C[0:4]
DDR4_1_CLK_T/C
DDR4_1_RST
DDR4
DDR4_0_A[0:16]
DDR4_0_BA[0:1]
DDR4_0_DM[0:8]
DDR4_0_DQ[0:71]
DDR4_0_A\DQS_T/C[0:8]
DDR4_0_CLK_T/C
DDR4_0_RST
I2C_0
25G MAC0
GT_RX_P/N
GT_RX_P/N
SFP0_REFCLK_RST
I2C_1
25G MAC1
GT_RX_P/N
GT_RX_P/N
SFP1_REFCLK_RST
JTAG
TCK
TMS
TDI
TDO
UART
100G MAC0
MAC0_CLK_P/N
MAC0_TX_P/N[0:3]
MAC0_RX_P/N[0:3]
MAC0_RST
I2C_0
Clock
Reset
PCIe Hard
Block Gen3 x8
PCIE_MGT_TX_P/N[0:7]
PCIE_MGT_RX_P/N[0:7]
PCIE_RST
PCIE_REFCLK_P/N
Clock
Buffer
MPSOC
RFSOC
Clock
Synchronizer
Level
Translator
Level
Translator
DDR4, x16
8GB + ECC
DDR4, x16
4GB + ECC
SFP28
SFP28
FTDI
Chip
Mini-USB
Conn
JTAG
TCK
TMS
TDI
TDO
UART
100G MAC0
MAC0_CLK_P/N
MAC0_TX_P/N[0:3]
MAC0_RX_P/N[0:3]
MAC0_RST
I2C_0
Clock
Reset
PCIe Hard
Block Gen3 x8
PCIE_REFCLK_P/N
PCIE_RST
PCIE_MGT_RX_P/N[0:7]
PCIE_MGT_TX_P/N[0:7]
EEPROM
Clock Generator
I2C Level
Translator
MCU
Outlet Temp
Sensor
Inlet Temp
Sensor
I2C_0
I2C_2
I2C_1
PSU
FTDI
Chip
CLOCK
Buffer
Configuration
Block
IO[0:7]
SCK
CS
DDR4
DDR4_1_A[0:16]
DDR4_1_BA[0:1]
DDR4_1_DM[0:4]
DDR4_1_DQ[0:39]
DDR4_1_A\DQS_T/C[0:4]
DDR4_1_CLK_T/C
DDR4_1_RST
DDR4
DDR4_0_A[0:16]
DDR4_0_BA[0:1]
DDR4_0_DM[0:8]
DDR4_0_DQ[0:71]
DDR4_0_A\DQS_T/C[0:8]
DDR4_0_CLK_T/C
DDR4_0_RST
QSPI Flash
Memory
DDR4, x16
8GB + ECC
DDR4, x16
4GB + ECC
OR
Module
PM
PCIE EDGE FINGER
PS
PS
VCC_0V72
VCC_0V85
VCC_0V9
VCC_1V2
VCC_1V8
VCC_3V3
VCC_12V
PCIE_12V
ATX_12V
PCIe
Gen
3.0
PCIE_REFCLK_P/N
PCIe
Gen
3.0
PPS_IN_MPSOC
PPS_IN_RFSOC
PPS_IN
PPS_OUT
25G
MAC
25G
MAC
100G MAC
X24621-092320
Chapter 1: Introduction
UG1495 (v1.0) December 17, 2021
T1 Telco Accelerator Card User Guide
6