WIRELESS CONNECTIVITY & SENSORS
User manual Proteus-II
Package thickness
Volume mm
3
<350
Volume mm
3
350-2000
Volume mm
3
>2000
< 1.6 mm
260 °C
260 °C
260 °C
1.6 mm - 2.5 mm
260 °C
250 °C
245 °C
> 2.5 mm
250 °C
245 °C
245 °C
Table 55: Package classification reflow temperature, PB-free assembly, Note: refer to IPC/-
JEDEC J-STD-020E
It is recommended to solder this module on the last reflow cycle of the PCB. For solder paste
use a LFM-48W or Indium based SAC 305 alloy (Sn 96.5 / Ag 3.0 / Cu 0.5 / Indium 8.9HF /
Type 3 / 89%) type 3 or higher.
The reflow profile must be adjusted based on the thermal mass of the entire populated PCB,
heat transfer efficiency of the reflow oven and the specific type of solder paste used. Based on
the specific process and PCB layout the optimal soldering profile must be adjusted and verified.
Other soldering methods (e.g. vapor phase) have not been verified and have to be validated
by the customer at their own risk. Rework is not recommended.
Time
Temperature
T
p
t
p
t
L
t
S
T
s max
T
s min
T
C
–5°C
T
L
25
Time 25°C to Peak
Preheat Area
Max. Ramp Up Rate
Max. Ramp Down Rate
Figure 16: Reflow soldering profile
Order code 2608011x24010
160
Version 1.11 , July 2022