45
*
* Highest accuracy only achievable at integer multiples of smallest pixel sizes
P
rinting
Hardware
Desktop
Software
Mobile Apps
O
perating Temperature
P
ower Requirement
O
ptical System
D
imension/Weight
P
rinting Technology
X
Y Resolution
B
uild Volume
S
eparation Mechanism
S
upport
H
ighest accuracy**
P
rinting Speed
Resin Level Control
M
echanical
L
ayer Thickness(Z resolution)
C
onnectivity
S
ystem Requirement
A
dvanced Features
C
ompatible Format
C
ompatible Systems
Suggested 18–28° C Suggested 64–82° F
1
00-240VAC, 6A 50/60Hz
5
500 Lux blue LED array
liquid cooling system
U
niz smart support technology
3
50 × 400 × 530 mm [W×H×D]
14" × 16" × 21", 14KG/30LB
L
CD Stereolithography
7
5μm
192 × 120 × 200mm
7.5" × 4.7" × 7.9"
P
olymer film natural peel
Up to 100x more durable than PDMS
UDP ready**
±20μm
Up to 600 mm/hr (UDP mode)
Up to 200 mm/hr (Normal mode)
A
utomatic level control
1
0, 25, 50, 100, 150, 200, 300μm
Profile customizable
C
ast Aluminum & CNC, Injection Molding
U
SB, Wifi, Ethernet
W
indows 7 and up (64-bit only)
Mac OS X 10.7 and up (64-bit only)
16GB RAM, OpenGL 2.1
Discrete Graphics
Multi-printer management
Built-in advanced model repair
Ultra large file support (1GB+)
S
TL, OBJ, AMF, 3MF, UNIZ
iPhone, iPad, Android Phone and Tablet
SLASH PLUS UDP
*Highest accuracy only achievable at integer multiples of smallest pixel sizes.
**Not applicable to all geometries, UDP specific design rules apply.
10, 25, 50, 75, 100, 150, 200, 300μm
Profile customizable
