C40
APPLICATIO OTES:
1.
Clean with alcohol after final pass.
2.
Clean with acetone after final pass.
3.
Clean with alcohol between passes.
4.
Clean with acetone after final pass.
5.
Use masking paper to prevent smoke damage.
6.
Use wet masking paper or liquid soap to prevent flame damage/edge defects.
7.
Use wet paper towel to prevent edge effect.
8.
May be cut wet or dry - wetness will often reduce edge effect.
9.
When cutting through material, raise material off of work surface to allow laser beam to
exit and to dissipate fumes.
10. Fill spacing should be three to five thousandths (.003-.005").
11. Use a medium stiffness camel hair brush to clean.
12. Brush off wires between passes with a stiff camel hair brush.
13. Cut one side, then brush. Flip over cable, cut and brush. Repeat two or more times for each
side until wire is bare. Make a final pass to clean up any residual teflon.
14. When cutting very small stencils (1/8" or .0125"), use a high resolution lens and cut the
stencil in two passes. Suspend the Mylar so it doesn't touch the plate and is level. This
setting will produce a stencil that is clean, and not melted, but will require some punching
through of the waste material.
15. When stripping Kapton, remove only a small amount on each pass and make three to five
passes to strip down to the conductor surface. Set fill spacing to 3 thousandths. This
method will prevent damage to the lower piece of Kapton, strip away the top Kapton and
leave a clean top surface on the copper traces.
16. Avonite can be cut to depths up to 1/16" or .060" and filled.
17. Use low power to avoid bubbling material. Focus can be changed to increase line width,
but power must also be increased to maintain the same effect.
