SARA-G3 series - System Integration Manual
UBX-13000995 - R06
Objective Specification
Appendix
Page 189 of 218
Appendix
A
Migration between LISA and SARA-G3 modules
A.1
Overview
Migrating between LISA-U1, LISA-U2, LISA-C2 series and SARA-G3 series wireless module designs is a
straight-forward procedure that allows customers to take maximum advantage of their hardware and software
investments.
SARA-G3 wireless modules (26.0 x 16.0 mm LGA) have a different form factor than LISA wireless
modules
(33.2 x 22.4 mm LCC), but the footprint for each SARA and LISA module has been developed so that
all the pads on the same lateral edge of the antenna pin can be shared on the application board, due to
the same pitch and nearly the same functions provided, as described in
64 63
61 60
58 57
55 54
22 23
25 26
28 29
31 32
11
10
8
7
5
4
2
1
21
19
18
16
15
13
12
43
44
46
47
49
50
52
53
33
35
36
38
39
41
42
65
66
67
68
69
70
71
72
73
74
75
76
77
78
79
80
81
82
83
84
85
86
87
88
89
90
91
92
93
94
95
96
CTS
RTS
DCD
RI
V_INT
V_BCKP
GND
RSVD
RESET_N
RSVD/ GPIO1
PWR_ON
RXD
TXD
3
20
17
14
9
6
24
27
30
51
48
45
40
37
34
59
62
56
GND
GND
DSR
DTR
GND
RSVD
GND
GND
R
X
D
_
A
U
X
T
X
D
_
A
U
X
E
X
T
3
2
/
R
S
V
D
G
N
D
R
S
V
D
/
G
P
IO
2
3
2
K
_
O
U
T
/G
P
IO
3
R
S
V
D
/
S
D
A
R
S
V
D
/
SCL
R
S
V
D
/
G
P
IO
4
G
N
D
G
N
D
GND
RSVD/ SPK_P
RSVD/ M IC_BIAS
RSVD/ M IC_GND
RSVD/ M IC_P
GND
VCC
VCC
RSVD
RSVD/ I2S_TXD
RSVD/ I2S_CLK
SIM _CLK
SIM _IO
VSIM
SIM _DET
VCC
RSVD/ M IC_N
RSVD/ SPK_N
SIM _RST
RSVD/ I2S_RXD
RSVD/ I2S_WA
G
N
D
G
N
D
G
N
D
G
N
D
G
N
D
G
N
D
G
N
D
G
N
D
G
N
D
R
S
V
D
/
A
N
T
_
D
E
T
ANT
SARA-G3 series
Top View
Pin 65-96: GND
65
64
63
62
61
60
59
58
57
56
55
54
53
52
51
50
49
48
47
46
45
44
43
42
41
GND
VCC
VCC
VCC
GND
SPI_M RDY
SPI_SRDY
SPI_M ISO
SPI_M OSI
SPI_SCLK
RSVD / SPK_N
GND
RSVD / SPK_P
RSVD
GPIO5
VSIM
SIM _RST
SIM _IO
SIM _CLK
SDA
SCL
RSVD / I2S_RXD
RSVD / I2S_CLK
RSVD / I2S_TXD
RSVD / I2S_WA
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
25
V_BCKP
GND
V_INT
RSVD
GND
GND
GND
DSR
RI
DCD
DTR
GND
RTS
CTS
TXD
RXD
GND
VUSB_DET
PWR_ON
GPIO1
GPIO2
RESET_N
GPIO3
GPIO4
GND
26
27
USB_D-
USB_D+
40
39
RSVD / M IC_P
RSVD / M IC_N
28 29 30 31 32 33 34 35 36 37 38
76 75 74 73 72 71 70 69 68 67 66
LISA-U1 series
Top View
G
N
D
R
S
V
D
G
N
D
G
N
D
G
N
D
G
N
D
G
N
D
ANT
G
N
D
G
N
D
G
N
D
G
N
D
G
N
D
G
N
D
G
N
D
G
N
D
G
N
D
G
N
D
G
N
D
G
N
D
G
N
D
G
N
D
65
64
63
62
61
60
59
58
57
56
55
54
53
52
51
50
49
48
47
46
45
44
43
42
41
GND
VCC
VCC
VCC
GND
SPI_M RDY / GPIO14
SPI_SRDY / GPIO13
SPI_M ISO / GPIO12
SPI_M OSI / GPIO11
SPI_SCLK / GPIO10
GPIO9 / I2S1_WA
GND
GPIO8 / I2S1_CLK
RSVD / CODEC_CLK
GPIO5
VSIM
SIM _RST
SIM _IO
SIM _CLK
SDA
SCL
RSVD / I2S_RXD
RSVD / I2S_CLK
RSVD / I2S_TXD
RSVD / I2S_WA
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
25
V_BCKP
GND
V_INT
RSVD
GND
GND
GND
DSR
RI
DCD
DTR
GND
RTS
CTS
TXD
RXD
GND
VUSB_DET
PWR_ON
GPIO1
GPIO2
RESET_N
GPIO3
GPIO4
GND
26
27
USB_D-
USB_D+
40
39
GPIO7 / I2S1_TXD
GPIO6 / I2S1_RXD
28 29 30 31 32 33 34 35 36 37 38
76 75 74 73 72 71 70 69 68 67 66
LISA-U2 series
Top View
G
N
D
R
S
V
D
/
A
N
T
_
D
IV
G
N
D
G
N
D
G
N
D
G
N
D
G
N
D
ANT
G
N
D
G
N
D
G
N
D
G
N
D
G
N
D
G
N
D
G
N
D
G
N
D
G
N
D
G
N
D
G
N
D
G
N
D
G
N
D
G
N
D
65
64
63
62
61
60
59
58
57
56
55
54
53
52
51
50
49
48
47
46
45
44
43
42
41
GND
VCC
VCC
VCC
GND
RSVD
RSVD
RSVD
RSVD
RSVD
SPK_N
GND
SPK_P
RSVD
GPIO5
VSIM
SIM _RST
SIM _IO
SIM _CLK
RSVD
RSVD
PCM _DI
PCM _CLK
PCM _DO
PCM _SYNC
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
25
RSVD
GND
V_INT
RSVD
GND
GND
GND
RSVD
RI
RSVD
RSVD
GND
RTS
CTS
TXD
RXD
GND
VUSB_DET
PWR_ON
GPIO1
GPIO2
RESET_N
GPIO3
GPIO4
GND
26
27
USB_D-
USB_D+
40
39
M IC_P
M IC_N
28 29 30 31 32 33 34 35 36 37 38
76 75 74 73 72 71 70 69 68 67 66
LISA-C2 series
Top View
G
N
D
R
S
V
D
G
N
D
G
N
D
G
N
D
G
N
D
G
N
D
ANT
G
N
D
G
N
D
G
N
D
G
N
D
G
N
D
G
N
D
G
N
D
G
N
D
G
N
D
G
N
D
G
N
D
G
N
D
G
N
D
G
N
D
Figure 69: LISA series vs. SARA-G3 series modules pin assignment: highlighted pads that can be shared on the application board
This is the basis of the Nested Design concept: any SARA-G3, LISA-U1, LISA-U2, or LISA-C2 module
can be mounted on the same nested board as shown in
, enabling straightforward
development of products supporting either GSM/GPRS, W-CDMA or CDMA wireless technology with the
same application board.