SARA-G3 series - System Integration Manual
UBX-13000995 - R06
Objective Specification
Handling and soldering
Page 174 of 218
Preheat
Heating
Cooling
[°C]
Peak Temp. 245°C
[°C]
250
250
Liquidus Temperature
217
217
200
200
40 - 60 s
End Temp.
max 4°C/s
150 - 200°C
150
150
max 3°C/s
60 - 120 s
100
Typical Leadfree
100
Soldering Profile
50
50
Elapsed time [s]
Figure 66: Recommended soldering profile
SARA-G3 series modules must not be soldered with a damp heat process.
