SARA-G3 series - System Integration Manual
UBX-13000995 - R06
Objective Specification
Handling and soldering
Page 175 of 218
3.2.3
Optical inspection
After soldering the SARA-G3 series modules, inspect the modules optically to verify that the module is
properly aligned and centered.
3.2.4
Cleaning
Cleaning the soldered modules is not recommended. Residues underneath the modules cannot be easily
removed with a washing process.
Cleaning with water will lead to capillary effects where water is absorbed in the gap between the
baseboard and the module. The combination of residues of soldering flux and encapsulated water leads
to short circuits or resistor-like interconnections between neighboring pads. Water will also damage the
sticker and the ink-jet printed text.
Cleaning with alcohol or other organic solvents can result in soldering flux residues flooding into the
two housings, areas that are not accessible for post-wash inspections. The solvent will also damage
the sticker and the ink-jet printed text.
Ultrasonic cleaning will permanently damage the module, in particular the quartz oscillators.
For best results use a "no clean" soldering paste and eliminate the cleaning step after the soldering.
3.2.5
Repeated reflow soldering
Only a single reflow soldering process is encouraged for boards with a SARA-G3 series module populated
on it. The reason for this is the risk of the module falling off due to high weight in relation to the
adhesive properties of the solder.
3.2.6
Wave soldering
Boards with combined through-hole technology (THT) components and surface-mount technology (SMT)
devices require wave soldering to solder the THT components. Only a single wave soldering process is
encouraged for boards populated with SARA-G3 series modules.
3.2.7
Hand soldering
Hand soldering is not recommended.
3.2.8
Rework
Rework is not recommended.
Never attempt a rework on the module itself, e.g. replacing individual components. Such actions
immediately terminate the warranty.
