User's Manual l TQMa8XxS UM 0101 l © 2022, TQ-Systems GmbH
Page 38
Attention: Destruction or malfunction, TQMa8XxS heat dissipation
The TQMa8XxS belongs to a performance category in which a cooling system is essential.
It is the user’s sole responsibility to define a suitable heat sink (weight and mounting position)
depending on the specific mode of operation (e.g., dependence on clock frequency, stack height,
airflow, and software). Particularly the tolerance chain (PCB thickness, board warpage, BGA balls, BGA
package, thermal pad, heatsink) as well as the maximum pressure on the i.MX 8X must be taken into
consideration when connecting the heat sink.
The i.MX 8X is not necessarily the highest component. Inadequate cooling connections can lead to
overheating of the TQMa8XxS and thus malfunction, deterioration or destruction.
4.7
Structural requirements
The TQMa8XxS has a low retention force and has to be mounted / secured according to customer requirements.
The superior system is defined by the customer depending on the usage of the TQMa8XxS.
5.
SOFTWARE
The TQMa8XxS is delivered with a preinstalled boot loader U-Boot and the
by TQ-Systems GmbH,
which is tailored for the MB-SMARC-2.
The boot loader U-Boot provides TQMa8XxS-specific as well as board-specific settings, e.g.:
•
i.MX 8X configuration
•
PMIC configuration
•
SDRAM configuration and timing
•
eMMC configuration
•
Multiplexing
•
Clocks
•
Pin configuration
•
Driver strengths
These settings have to be adapted, in case another bootloader is used.
More information can be found in the
TQ-Support Wiki for the TQMa8XxS
