User's Manual l TQMa8XxS UM 0101 l © 2022, TQ-Systems GmbH
Page 5
2.2
Key functions and characteristics
The TQMa8XxS extends the TQ-Systems GmbH product range and offers an outstanding computing performance.
A suitable i.MX 8X derivative (i.MX 8DualX, i.MX 8DualXPlus or i.MX 8QuadXPlus) can be selected for each requirement.
The signals are routed to the card edge connector according to SMARC 2.0. All essential components like CPU, LPDDR4 SDRAM,
eMMC, and power management are already integrated on the TQMa8XxS. The main features of the TQMa8XxS are:
•
64-bit NXP i.MX 8X CPU with up to 4 × ARM
®
Cortex
®
-A35 and 1 × ARM
®
Cortex
®
-M4F
•
Derivatives: i.MX 8DualX / i.MX 8DualXPlus / i.MX 8QuadXPlus
•
Standard form factor according to SMARC 2.0 (82 mm x 50 mm)
•
Up to 4 GByte LPDDR4 SDRAM (32 bit)
•
Up to 32 Gbyte eMMC NAND flash
•
Up to 256 Mbyte QSPI NOR flash (optional)
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64 kbit EEPROM
•
temperature sensor
•
DSI-to-eDP bridge
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PCIe clock generator
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NXP Power Management, “ASIL B” ready
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RTC (optional)
•
Trust Secure Element (optional)
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Temperature sensor
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Interface compatibility according to SMARC 2.0
•
Boot mode selection on TQMa8XxS
•
3.3 V fixed supply voltage (optional: extended voltage range of 3.0 V to 5.25 V)
•
Form factor 82 mm x 50 mm
The IO voltage of most interfaces is set to 1.8 V by the SMARC standard. Signals for differential high-speed interfaces have
different standardized IO levels.
