User's Manual l TQMa8XxS UM 0101 l © 2022, TQ-Systems GmbH
Page 36
Figure 34: TQMa8XxS heights with heatspreader
Table 22: Heights
Property Value Tolerance Unit Remark
A
1,55
±0,15
mm
Board to board distance
B
1,20
±0,12
mm
Printed circuit board thickness
C
2,27
±0,15
mm
Processor height (typically highest component)
D
0,43
±0,09
mm
Installation space under the module
E
5,02
±0,20
mm
Total height from top edge of base board to CPU surface
E1
8,75
±0,24
mm
Total height from top edge of baseboard to surface of heatspreader
F
1,09
±0,10
mm
Height LPDDR4
4.3
Component placement
Figure 35: TQMa8XxS, component placement top
