Inverter fixing board
Bundling band
TS sensor
TE sensor
TO sensor
Bundling band
TE sensor
TO sensor
No.
1
8
Part name
Sensor wiring
process
(Continued)
Procedure
∗
Bind TS sensor, TE sensor and TO sensor with
the bundling band.
∗
Pass TE sensor and TO sensor through upper
part of the inverter fixing board and then bind
them with the bundling band.
NOTE)
Using the bundling band being on the market,
be sure to bind the position which was bound.
Remarks
19
Pressure
switch
1. Detachment
1) Perform work of Detachment 1 of 1.
2) Recover the refrigerant gas from the outdoor unit.
3) Peform works of 2, 3 and 4.
4) Remove the soundproof plate
,
TD sensor
,
Reactor on the partition plate and butyl on the pipe
of pressure switch.
5)
Take care that the electric parts, 4-way valve unit,
butyle, compressor, accum tank, and etc. are not
caught by flame.
(Otherwise operaion trouble may occur.)
2. Attachment
•
Be sure not to burn lead wire of the pressure switch.
•
Take care there is no missing of sensor.
NOTE)
Take care that the body
of
the
pressure
is
not
be 100°C or more.
For
cool
ing pressure switch, use
the we
t
towel
and
etc.
Use t
he protective plate for the welding
.
Using a burner, remove the welded parts
of
the pipe of pressure switch.
NOTE)
FILE NO. SVM-18052
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