Themis RES - 32XR3, Installation Manual

Page: 136 / 142

RES-21XR3 for X8SAX Installation Manual
Index-2
Themis Computer
COM1 / COM2 serial port/header 1-9
Comments xxiii
components, major 1-5
Configuration, system 2-19
Configure SATA#1 as 3-14
CPU 1-1
CPU Overheat Alarm 3-21
CPU Overheat LED and Control 1-11
CPU Ratio 3-7
CPU Temperature 3-21
C-State Package Limit Setting 3-10
C-STATE Tech 3-9
D
DCA Prefetch Delay 3-10
DCA Technology 3-10
Demand Scrubbing 3-12
Dimensions, chassis 1-2
E
ECC DDR3 SDRAM
memory modules 2-5
ECC SDRAM 1-2
Electrical Specifications 1-15
Electrostatic Discharge 1-16
EMI xxii
Environmental Specifications 1-16
ESD
grounding techniques 2-1
protected mat 2-1
Ethernet A-2
Execute-Disable Bit Capability 3-8
Exit Options 3-29
Discard Changes 3-30
Discard Changes and Exit 3-30
Load Fail-Safe Defaults 3-30
Load Optimal Defaults 3-30
Save Changes and Exit 3-30
Expansion slots 1-2
F
Fan Speed Control Modes 3-23
Fan Status Monitor with Firmware Control 1-11
Fan1—Fan 5 Reading 3-23
Features of the LGA 1366 Processor and the
X58 1-10
flanges 2-17
Floppy A 3-14
Flow Control 3-20
form-factor, 2RU 1-2
Fourth IDE Master 3-15
front bezel 2-10
front bezel doors 2-11
Front I/O 16" Chassis Manual Matrix (AC and
DC Power Supplies) xxii
front panel 1-4
fused AC 1-15
G
General Specifications 1-14
Gigabit Ethernet A-2
graphics connector 2-19
H
Hardware Prefetcher 3-8
Headless Mode 3-25
High Definition Audio A-3
High Definition Audio (HDA) A-3
High Performance Event Timer 3-24
Hit 'Del' Message Display 3-6
Hot-Swappable 80-mm Fan 2-14
I
I/O Connectors
Ethernet LAN Port 1-9
PS/2 keyboard 1-9
PS/2 mouse 1-9
Serial Ports 1-9
USB Serial Ports 1-9
I/O connectors 1-5
I/O faceplates 1-4
ICH RAID Code Base 3-14
PXH/V 1-2
PXH/V xxiii