Themis RES - 32XR3, Installation Manual

Page: 24 / 142

RES-21XR3 for X8SAX Installation Manual
xxii
Themis Computer
The 2RU-high (3.5”) RES-21XR3 has been designed to fit into a standard 19” rack
and is provided with rack-mount brackets with handles.
Optional rack-mount slides
are also available. The RES-21XR3 is rugged enough to withstand extreme shock
(up to 35G), vibration, temperature, and EMI as that associated with such demand-
ing markets as the military, aerospace, and telecommunications industries.
The single Intel 5500-Series/5600-Series Xeon ® CPU supports up to 24 GigaBytes of
DDR3 ECC DIMM memory modules. The RES-21XR3 is based on the functionality
and capability of the following Intel chipset:
• Intel X58 Express chipset
Table 3. Front I/O 16” Chassis Manual Matrix (AC and DC Power Supplies)
Mother-
board
CPU
Soc
kets
RES-32XR3/FIO Manual P/N RES-22XR3/FIO Manual P/N
X8DAH+-F * 2 117611-024
X8DTU-F 2 117664-024
Naming Key: X8 uvwxyz System RES- x 2XR3S and RES- x 1XR3, where
x = 3, 2, or 1
*RES-32XR3/FIO motherboard X8DAH+-F supports both audio and video;
however, the naming key does not contain a “T” in the title.
u: D = Double CPU sockets
S = Single CPU socket
v: A = Sound chip; no graphics chip
T = Graphics chip; no sound chip
w: Not applicable
x: i = SATA only
3 = SAS 1.0
6 = SAS 2.0
y: LN4 = Extra gigabit Ethernet controller for two extra ports
z: F = IPMI
blank = No IPMI
Note: Those customers who desire a RES-21XR3 with no handles or front doors
may order this option instead of the basic model shown throughout this manual of
the RES-21XR3 with two handles and two front doors and filters.