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TMS320F28069, TMS320F28068, TMS320F28067, TMS320F28066
TMS320F28065, TMS320F28064, TMS320F28063, TMS320F28062
www.ti.com
SPRS698F – NOVEMBER 2010 – REVISED MARCH 2016
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TMS320F28069 TMS320F28068 TMS320F28067 TMS320F28066 TMS320F28065
TMS320F28064 TMS320F28063 TMS320F28062
Specifications
Copyright © 2010–2016, Texas Instruments Incorporated
(1)
These values are based on a JEDEC-defined 2S2P system (with the exception of the Theta JC [R
Θ
JC
] value, which is based on a
JEDEC-defined 1S0P system) and will change based on environment as well as application. For more information, see these
EIA/JEDEC standards:
•
JESD51-2,
Integrated Circuits Thermal Test Method Environmental Conditions - Natural Convection (Still Air)
•
JESD51-3,
Low Effective Thermal Conductivity Test Board for Leaded Surface Mount Packages
•
JESD51-7,
High Effective Thermal Conductivity Test Board for Leaded Surface Mount Packages
•
JESD51-9,
Test Boards for Area Array Surface Mount Package Thermal Measurements
(2)
lfm = linear feet per minute
5.7
Thermal Resistance Characteristics
5.7.1
PFP PowerPAD Package
°C/W
(1)
AIR FLOW (lfm)
(2)
R
Θ
JC
Junction-to-case thermal resistance
9.4
0
R
Θ
JB
Junction-to-board thermal resistance
4.6
0
R
Θ
JA
(High k PCB)
Junction-to-free air thermal resistance
25.8
0
16.3
150
15.2
250
13.6
500
Psi
JT
Junction-to-package top
0.3
0
0.4
150
0.4
250
0.5
500
Psi
JB
Junction-to-board
4.6
0
4.4
150
4.3
250
4.3
500
(1)
These values are based on a JEDEC-defined 2S2P system (with the exception of the Theta JC [R
Θ
JC
] value, which is based on a
JEDEC-defined 1S0P system) and will change based on environment as well as application. For more information, see these
EIA/JEDEC standards:
•
JESD51-2,
Integrated Circuits Thermal Test Method Environmental Conditions - Natural Convection (Still Air)
•
JESD51-3,
Low Effective Thermal Conductivity Test Board for Leaded Surface Mount Packages
•
JESD51-7,
High Effective Thermal Conductivity Test Board for Leaded Surface Mount Packages
•
JESD51-9,
Test Boards for Area Array Surface Mount Package Thermal Measurements
(2)
lfm = linear feet per minute
5.7.2
PZP PowerPAD Package
°C/W
(1)
AIR FLOW (lfm)
(2)
R
Θ
JC
Junction-to-case thermal resistance
9.4
0
R
Θ
JB
Junction-to-board thermal resistance
4.4
0
R
Θ
JA
(High k PCB)
Junction-to-free air thermal resistance
24.4
0
15.1
150
13.9
250
12.4
500
Psi
JT
Junction-to-package top
0.3
0
0.4
150
0.4
250
0.5
500
Psi
JB
Junction-to-board
4.5
0
4.2
150
4.2
250
4.2
500