SLVS695D – JUNE 2007 – REVISED JANUARY 2015
7 Specifications
7.1 Absolute Maximum Ratings
over operating free-air temperature range (unless otherwise noted)
(1)
MIN
MAX
UNIT
V
DD
Supply voltage
0
7
V
V
I
Input voltage
–0.4
V
DD
+ 0.4
V
V
O
Output voltage
–0.5
20
V
f
clk
Clock frequency
25
MHz
I
OUT
Output current
120
mA
I
GND
GND terminal current
960
mA
T
A
Operating free-air temperature
–40
125
°C
T
J
Operating junction temperature
–40
150
°C
T
stg
Storage temperature
–55
150
°C
(1)
Stresses beyond those listed under
Absolute Maximum Ratings
may cause permanent damage to the device. These are stress ratings
only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under
Recommended
Operating Conditions
. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
7.2 ESD Ratings
VALUE
UNIT
Human-body model (HBM), per ANSI/ESDA/JEDEC JS-001
(1)
±1500
V
(ESD)
Electrostatic discharge
V
Charged-device model (CDM), per JEDEC specification JESD22-
±500
C101
(2)
(1)
JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.
(2)
JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.
7.3 Recommended Operating Conditions
MIN
MAX
UNIT
V
DD
Supply voltage
3
5.5
V
V
O
Supply voltage to output pins
OUT0–OUT7
20
V
V
O
≥
0.6 V
3
I
O
Output current
DC test circuit
mA
V
O
≥
1 V
120
I
OH
High-level output current source
SDO shorted to GND
–1
mA
I
OL
Low-level output current sink
SDO shorted to V
CC
1
mA
V
IH
High-level input voltage
CLK, OE(ED2), LE(ED1), and SDI
0.7 × V
DD
V
DD
V
V
IL
Low-level input voltage
CLK, OE(ED2), LE(ED1), and SDI
0
0.3 × V
DD
V
7.4 Thermal Information
TLC5916
TLC5917
THERMAL METRIC
(1)
16 PINS
16 PINS
UNIT
D
N
PW
D
N
PW
R
θ
JA
Junction-to-ambient thermal resistance
87.4
51.8
113.9
87.4
51.8
114.8
R
θ
JC(top)
Junction-to-case (top) thermal resistance
48.1
39.1
35.2
48.1
39.1
35.9
R
θ
JB
Junction-to-board thermal resistance
44.4
31.8
59.2
44.4
31.8
59.8
°C/W
ψ
JT
Junction-to-top characterization parameter
12.5
23.9
1.3
12.5
23.9
1.3
ψ
JB
Junction-to-board characterization parameter
44.2
31.7
58.5
44.2
31.7
59.2
R
θ
JC(bot)
Junction-to-case (bottom) thermal resistance
—
—
—
—
—
—
(1)
For more information about traditional and new thermal metrics, see the
IC Package Thermal Metrics
application report,
4
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