8 Specifications
8.1 Absolute Maximum Ratings
over operating free-air temperature range (unless otherwise noted)
MIN
MAX UNIT
VDDS
Supply voltage
–0.3
4.1
V
VDDS and
VDDR
Supply voltage (External regulator mode)
–0.3
2.25
V
–0.3
VDDS + 0.3, max 4.1
V
Voltage on crystal oscillator pins, X32K_Q1, X32K_Q2, X48M_N and X48M_P
–0.3
VDDR + 0.3, max 2.25
V
V
in
Voltage on ADC input
Voltage scaling enabled
–0.3
VDDS
V
Voltage scaling disabled, internal reference
–0.3
1.49
Voltage scaling disabled, VDDS as reference
–0.3
VDDS / 2.9
5
dBm
T
stg
Storage temperature
–40
150
°C
(1)
Stresses beyond those listed under
Absolute Maximum Ratings
may cause permanent damage to the device. These are stress ratings
only, and functional operation of the device at these or any other conditions beyond those indicated under
Recommended Operating
Conditions
is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
(2)
All voltage values are with respect to ground, unless otherwise noted.
(3)
VDDS_DCDC, VDDS2 and VDDS3 must be at the same potential as VDDS.
(4)
Including analog capable DIOs.
(5)
VDDR, VDDS, VDDS2 and VDDS3 must be at the same potential.
8.2 ESD Ratings
VALUE
UNIT
V
ESD
Electrostatic
discharge
Human body model (HBM), per ANSI/ESDA/JEDEC JS-001
All pins
±2000
V
Charged device model (CDM), per ANSI/ESDA/JEDEC JS-002
All pins
±500
V
(1)
JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process
(2)
JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process
8.3 Recommended Operating Conditions
over operating free-air temperature range (unless otherwise noted)
MIN
MAX
UNIT
Operating ambient temperature
–40
85
°C
Operating supply voltage (VDDS and VDDR), external
regulator mode
For operation in 1.8-V systems
(VDDS and VDDR pins connected on PCB,
internal DC-DC cannot be used)
1.7
1.95
V
Operating supply voltage (VDDS)
1.8
3.8
V
Rising supply voltage slew rate
0
100
mV/µs
Falling supply voltage slew rate
0
20
mV/µs
(1)
For small coin-cell batteries, with high worst-case end-of-life equivalent source resistance, a 22-µF VDDS input capacitor must be used
to ensure compliance with this slew rate.
SWRS232D – FEBRUARY 2019 – REVISED FEBRUARY 2021
Copyright © 2021 Texas Instruments Incorporated
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