MSP430G2744, MSP430G2544, MSP430G2444
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SLAS892C – MARCH 2013 – REVISED SEPTEMBER 2014
5
Specifications
5.1
Absolute Maximum Ratings
(1) (2)
MIN
MAX
UNIT
Voltage applied at V
CC
-0.3
4.1
V
Voltage applied to any pin
(3)
-0.3
V
CC
+ 0.3
V
Diode current at any device terminal
±2
mA
(1)
Stresses beyond those listed under
Absolute Maximum Ratings
may cause permanent damage to the device. These are stress ratings
only, and functional operation of the device at these or any other conditions beyond those indicated under
Recommended Operating
Conditions
is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
(2)
All voltages referenced to V
SS
.
(3)
The JTAG fuse-blow voltage, V
FB
, is allowed to exceed the absolute maximum rating. The voltage is applied to the TEST pin when
blowing the JTAG fuse.
5.2
Handling Ratings
MIN
MAX
UNIT
T
stg
Storage temperature (programmed or unprogrammed device)
(1)
-55
150
°C
(1)
Higher temperature may be applied during board soldering process according to the current JEDEC J-STD-020 specification with peak
reflow temperatures not higher than classified on the device label on the shipping boxes or reels.
5.3
Recommended Operating Conditions
(1) (2)
Typical values are specified at V
CC
= 3.3 V and T
A
= 25°C (unless otherwise noted)
MIN
NOM
MAX
UNIT
During program execution
1.8
3.6
V
V
CC
Supply voltage
AV
CC
= DV
CC
= V
CC
During program and erase of
2.2
3.6
V
flash memory
V
SS
Supply voltage
AV
SS
= DV
SS
= V
SS
0
V
T
A
Operating free-air temperature
-40
85
°C
V
CC
= 1.8 V, Duty cycle = 50% ±10%
dc
4.15
Processor frequency
f
SYSTEM
(maximum MCLK frequency)
(1) (2)
V
CC
= 2.7 V, Duty cycle = 50% ±10%
dc
12
MHz
(see
Figure 5-1
)
V
CC
≥
3.3 V, Duty cycle = 50% ±10%
dc
16
(1)
The MSP430 CPU is clocked directly with MCLK. Both the high and low phase of MCLK must not exceed the pulse width of the
specified maximum frequency.
(2)
Modules might have a different maximum input clock specification. See the specification of the respective module in this data sheet.
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Specifications
13
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