11 Environmental Requirements and Specifications
11.1 PCB Bending
The PCB bending specification will maintain planeness at a thickness of less than 0.1 mm.
11.2 Handling Environment
11.2.1 Terminals
The product is mounted with motherboard through land-grid array (LGA). To prevent poor soldering, do not make
skin contact with the LGA portion.
11.2.2 Falling
The mounted components will be damaged if the product falls or is dropped. Such damage may cause the
product to malfunction.
11.3 Storage Condition
11.3.1 Moisture Barrier Bag Before Opened
A moisture barrier bag must be stored in a temperature of less than 30°C with humidity under 85% RH. The
calculated shelf life for the dry-packed product will be 12 months from the date the bag is sealed.
11.3.2 Moisture Barrier Bag Open
Humidity indicator cards must be blue, < 30%.
11.4 Baking Conditions
Products require baking before mounting if:
• Humidity indicator cards read > 30%
• Temp < 30°C, humidity < 70% RH, over 96 hours
Baking condition: 90°C, 12 to 24 hours
Baking times: 1 time
SWRS206E – MARCH 2017 – REVISED MAY 2021
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