Texas Instruments ADS868 Series, Manual

Page: 6 / 67

ADS8684, ADS8688
SBAS582C – JULY 2014 – REVISED APRIL 2015 www.ti.com
7 Specifications
7.1 Absolute Maximum Ratings
over operating free-air temperature range (unless otherwise noted)
(1)
MIN MAX UNIT
AIN_ n P to AIN_ n GND
(2)
–20 20 V
AIN_ n P to AIN_ n GND
(3)
–11 11 V
AIN_ n GND to GND –0.3 0.3 V
AUX_IN to GND –0.3 AVDD + 0.3 V
AVDD to GND or DVDD to GND –0.3 7 V
REFCAP to REFGND or REFIO to REFGND –0.3 5.7 V
GND to REFGND –0.3 0.3 V
Digital input pins to GND –0.3 DVDD + 0.3 V
Digital output pins to GND –0.3 DVDD + 0.3 V
Operating temperature, T
A
–40 125 °C
Storage temperature, T
stg
–65 150 °C
(1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings
only, and do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended
Operating Conditions . Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
(2) AVDD = 5 V or offers a low impedance of < 30 k Ω .
(3) AVDD = floating with an impedance > 30 k Ω .
7.2 ESD Ratings
VALUE UNIT
Analog input pins
±6000
(AIN_ n P; AIN_ n GND)
Human body model (HBM), per ANSI/ESDA/JEDEC JS-001
(1)
Electrostatic
V
(ESD)
V
discharge All other pins ±2000
Charged device model (CDM), per JEDEC specification JESD22-C101
(2)
±500
(1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.
(2) JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.
7.3 Recommended Operating Conditions
over operating free-air temperature range (unless otherwise noted)
MIN NOM MAX UNIT
AVDD Analog supply voltage 4.75 5 5.25 V
DVDD Digital supply voltage 1.65 3.3 AVDD V
7.4 Thermal Information
ADS8684,
ADS8688
THERMAL METRIC
(1)
UNIT
DBT (TSSOP)
38 PINS
R
θ JA
Junction-to-ambient thermal resistance 68.8
R
θ JC(top)
Junction-to-case (top) thermal resistance 19.9
R
θ JB
Junction-to-board thermal resistance 30.4
°C/W
ψ
JT
Junction-to-top characterization parameter 1.3
ψ
JB
Junction-to-board characterization parameter 29.8
R
θ JC(bot)
Junction-to-case (bottom) thermal resistance NA
(1) For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953 .
6 Submit Documentation Feedback
Copyright © 2014–2015, Texas Instruments Incorporated
Product Folder Links: ADS8684 ADS8688