40mils (1mm)
40mils(1mm)
40mils(1mm)
118mils(3mm)
40mils (1mm)
118mils (3mm)
Thermal Via
13mils (0.33mm)
316mils (8mm)
316mils (8mm)
Thermal Pad
Package Outline
SBAS367F
–
JUNE 2007
–
REVISED FEBRUARY 2011
Figure 93. Thermal Pad Etch and Via Pattern for the HTQFP-64 Package
42
©
2007
–
2011, Texas Instruments Incorporated
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