SBAS367F
–
JUNE 2007
–
REVISED FEBRUARY 2011
This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with
appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.
ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more
susceptible to damage because very small parametric changes could cause the device not to meet its published specifications.
ORDERING INFORMATION
For the most current package and ordering information, see the Package Option Addendum at the end of this
document, or visit the device product folder at
ABSOLUTE MAXIMUM RATINGS
Over operating free-air temperature range unless otherwise noted
(1)
ADS1274, ADS1278
UNIT
AVDD to AGND
–
0.3 to +6.0
V
DVDD, IOVDD to DGND
–
0.3 to +3.6
V
AGND to DGND
–
0.3 to +0.3
V
Momentary
100
mA
Input current
Continuous
10
mA
Analog input to AGND
–
0.3 to AVDD + 0.3
V
Digital input or output to DGND
–
0.3 to IOVDD + 0.3
V
Maximum junction temperature
+150
°
C
ADS1274
–
40 to +125
°
C
Operating temperature range
ADS1278
–
40 to +105
°
C
Storage temperature range
–
60 to +150
°
C
(1)
Stresses above these ratings may cause permanent damage. Exposure to absolute maximum conditions for extended periods may
degrade device reliability. These are stress ratings only, and functional operation of the device at these or any other conditions beyond
those specified is not implied.
2
©
2007
–
2011, Texas Instruments Incorporated
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