IC Die
Wire Bond
Wire Bond
Leadframe Die Pad
Exposed at Base of Package
Die Attach Epoxy
(thermally conductive)
Leadframe
Mold Compound
(Epoxy)
SBAS367F
–
JUNE 2007
–
REVISED FEBRUARY 2011
PowerPAD THERMALLY-ENHANCED
die pad to be attached to the PCB using standard
PACKAGING
flow soldering techniques. This configuration allows
efficient attachment to the PCB and permits the board
The PowerPAD concept is implemented in standard
structure to be used as a heatsink for the package.
epoxy resin package material. The integrated circuit
Using a thermal pad identical in size to the die pad
is attached to the leadframe die pad using thermally
and vias connected to the PCB ground plane, the
conductive epoxy. The package is molded so that the
board designer can now implement power packaging
leadframe die pad is exposed at a surface of the
without additional thermal hardware (for example,
package. This design provides an extremely low
external heatsinks) or the need for specialized
thermal resistance to the path between the IC
assembly instructions.
junction and the exterior case. The external surface
of the leadframe die pad is located on the printed
illustrates a cross-section view of a
circuit board (PCB) side of the package, allowing the
PowerPAD package.
Figure 91. Cross-Section View of a PowerPAD Thermally-Enhanced Package
40
©
2007
–
2011, Texas Instruments Incorporated
Product Folder Link(s):