START-UP
4.8.5
Summary automatic profiling
a. Determine the required Profile Temperatures and edit the appropriate Profile
Temperature Table and PROFILE recipe.
b. Prepare the system using the Automatic Profiling Preparation Procedure. This places
the Profile TC and assigns the control zones.
c. Start the PROFILE recipe using an approximate process load.
d. Unload the wafers when finished.
e. Unassign the Temperature Control Zones and remove the Profile TC if required.
f. Read new profile table from DTC to PC
g. Print new profile table and compare with previous profile table. Large variations
(>10
o
C) in spike TC values indicate too long profiling interval, increase profiling
frequency.
h. The system is now ready for normal processing.
F
URNACE
R
EFERENCE
M
ANUAL
4-13
