Tektronix IsoVu TIVM Series, User Manual

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List of Figures
Figure i: TIVM Series IsoVu Measurement System............................................................ x
Figure 1: Maximum safe handling limits for common mode voltages between the sensor head and earth
ground. .......................................................................................................... 5
Figure 2: RF burn hazard zone around the sensor head ........................................................ 6
Figure 3: Controller indicators and buttons...................................................................... 7
Figure 4: Labels on the sensor head .............................................................................. 9
Figure 5: Sensor tip cable top and bottom labels ............................................................... 9
Figure 6: Connect the Comp box to the oscilloscope.......................................................... 11
Figure 7: Connecting the sensor tip cable to the sensor head................................................. 11
Figure 8: Connect the sensor head to the fl exible tripod ...................................................... 12
Figure 9: Probe Setup menu...................................................................................... 14
Figure 10: Digital
fi lter aliasing ................................................................................. 15
Figure 11: Digital fi lter aberrations (about 2.5% of V
p-p
) ..................................................... 16
Figure 12: Digital fi lter aberrations after disabling offset correction ........................................ 17
Figure 13: Top sensor tip labels.................................................................................. 17
Figure 14: Bottom sensor tip labels ............................................................................. 20
Figure 15: Half-bridge circuit showing the gate, source, and drain of the high-side FET................. 23
Figure 16: High-side turn-on characteristics ................................................................... 24
Figure 17: High side current shunt .............................................................................. 25
Figure 18: SMT resistor model .................................................................................. 26
Figure 19: ESD discharge test example......................................................................... 27
Figure 20: Sensor head dimensions with probe tip cover ..................................................... 33
Figure 21: Sensor head dimensions without probe tip cover ................................................. 34
Figure 22: Controller dimensions................................................................................ 34
Figure 23: Comp box dimensions ............................................................................... 35
Figure 24: Probe tip adapter dimensions........................................................................ 35
Figure 25: Block diagram ........................................................................................ 36
Figure 26: Installing the
fl exible tripod under the DUT. ...................................................... 37
Figure 27: Connecting the sensor head to the top of the DUT with the fl exible tripod. ................... 37
Figure 28: Connecting to an adapter on the circuit board with the probe tip tripod ....................... 38
Figure 29: Lining up the MMCX-to-0.1-inch (2.54 mm) adapter on the circuit board .................... 39
Figure 30: Lining up the MMCX-to-0.062-inch (1.57 mm) adapter on the circuit board ................. 40
Figure 31: Pushing the MMCX-to-0.062-inch (1.57 mm) adapter in place................................. 40
Figure 32: Pushing the MMCX-to-0.1-inch (2.54 mm) adapter in place.................................... 41
Figure 33: Adapter clearance requirements .................................................................... 42
Figure 34: Removing the header from square pins on the circuit board..................................... 43
Figure 35: Using the soldering aide to install the square pins on the circuit board ........................ 44
Figure 36: Propagation delay measurement .................................................................... 50
TIVM Series Measurement System User Manual iii